• Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
  • Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
  • Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
  • Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
  • Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
  • Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Variety: D230 Epoxy Resin Hardener
Feature: Stocked
Usage: Organic Chemical Material
Status: Liquid State
Application: Epoxy Resin Curing Agent
Color: Colorless or Light Yellow
Samples:
US$ 1/kg 1 kg(Min.Order)
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Manufacturer/Factory

Basic Info.

Model NO.
D230 epoxy hardener
Amine Value
440-480
Transport Package
200kg/Drum
Specification
Modified aliphatic amine
Trademark
HANEPOXY
Origin
China
Production Capacity
100000tons/Year

Product Description

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
D-230 is characterized by repeating oxypropylene units in the backbone. It is a
difunctional, primary amine with an average molecular weight of about 230.


Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
The physical and chemical properties 
Appearance Colorless or Light Yellow Transparent Liquid
Color, Pt-Co <30
Water, % ≤0.5
Amine value (mgKOH/g) 440~480
Primary Amine, % ≥97
Specific Gravity, 25
o C, g/cm3
0.948
Refractive Index, n D 20 1.4466
AHEW (Amine hydrogen equivalent wt.),g/eq 60
 
Application

-Epoxy resin curing agent, adhesive (hard rubber) curing agent, curing agent for wind
power blade
-Polyamide hot melt adhesive, electronic sealing glue curing agent
-electronic potting resin curing agent, curing agent for electronic packaging materials
-Fast curing RIM, building structure adhesive curing agent
-Polyether amine - modified curing agent, anticorrosive paint curing agent
-rod, golf clubs, tennis racket composite curing agent


Storage and packaging

Stored in a cool and dry place with ventilation and can be sealed for 12 months.
Avoid direct contact with water or strong acid and alkali.
Package:200kg/ iron drum.

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Compnay Profile

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Han Epoxy (Short for Wuhan Jiangling Technology Co.,Ltd) established in 2008,is an enterprise whose main business is the research and development, production, sales, and application services of epoxy new materials; using advanced technology, perfect service, to serve the world's epoxy material customers .

Our main products: modified aromatic amines, aliphatic amines, alicyclic amines, phenalkamines, polyamides, cardanol epoxy resin curing agents, water-based epoxy curing agents, etc., which are widely used in floor paints, anti-corrosion coatings, and construction .We also have strong market competitiveness in many fields such as structural glue, stone repair, beautiful seam glue, and composite materials.

Our production base is located in Dongmafang Industrial Park, Yingcheng City, Hubei Province,China. It covers an area of 30,000 square meters and has a production capacity of 50,000 tons per year ,with 14 national patents and is a national high-tech enterprise declared enterprise. We are willing to sincerely cooperate with friends at home and abroad with first-class products, first-class reputation and first-class service for common development and create brilliant.

Packing and delivery


Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing AgentEpoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 for Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent


 

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Gold Member Since 2021

Suppliers with verified business licenses

Manufacturer/Factory
Registered Capital
500000 RMB
Plant Area
>2000 square meters